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PSMI40-06 Datasheet, PDF (1/2 Pages) Powersem GmbH – CoolMOS Power MOSFET
CoolMOS Power MOSFET
in ECO-PAC 2
PSMI 40/06
N-Channel Enhancement Mode
Low RDSon, High VDSS MOSFET
Package with Electrically Isolated Base
Preliminary Data Sheet
L4
L6
L9
P18
R18
K12
NTC
K13
ECO-PACTM 2
ID25
VDSS
RDSon
= 38 A
= 600 V
= 70 mΩ
1)
MOSFET
Features
Symbol
VDSS
VGS
ID25
ID90
dv/dt
EAS
EAR
Conditions
TVJ = 25°C to 150°C
TC = 25°C
TC = 90°C
VDS < VDSS; IF ≤ 50A;diF/dt≤ 200A/µs
TVJ = 150°C
ID = 10 A; L = 36 mH; TC = 25°C
ID = 20 A; L = 5 µH; TC = 25°C
Maximum Ratings
600
V
±20
V
38
A
25
A
6 V/ns
1.8
J
1
mJ
Symbol
RDSon
VGSth
IDSS
IGSS
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
VF
RthJC
Conditions
Characteristic Values
(TVJ = 25°C, unless otherwise specified)
min. typ. max.
VGS = 10 V; ID = ID90
VDS = 20 V; ID = 3 mA;
VDS = VDSS; VGS = 0 V; TVJ = 25°C
TVJ = 125°C
VGS = ±20 V; VDS = 0 V
VGS= 10 V; VDS = 350 V; ID = 50 A
70 m Ω
3.5
5.5 V
25 µA
60
µA
100 nA
220
nC
55
nC
125
nC
VGS= 10 V; VDS = 380 V;
ID = 25 A; RG = 1.8 Ω
30
ns
95
ns
100
ns
10
ns
(reverse conduction) IF = 20 A; VGS = 0 V
per MOSFET
0.9 1.1 V
0.45 K/W
Data according to IEC 60747 refer to a single diode or transistor unless otherwise stated
Caution: These Devices are sensitive
to electrostatic discharge. Users should
observe proper ESD handling precautions.
• ECO-PAC 2 with DCB Base
- Electrical isolation towards the
heatsink
- Low coupling capacitance to the heatsink
for reduced EMI
- High power dissipation
- High temperature cycling capability
of chip on DCB
- solderable pins for DCB mounting
• fastCoolMOSpowerMOSFET-2ndgeneration
- High blocking capability
- Low on resistance
- Avalanche rated for unclamped
inductive switching (UIS)
- Low thermal resistance
due to reduced chip thickness
• Enhanced total power density
• UL registered, E 148688
Applications
• Switched mode power supplies (SMPS)
• Uninterruptible power supplies (UPS)
• Power factor correction (PFC)
• Welding
• Inductive heating
Advantages
• Easy to mount with two screws
• Space and weight savings
• Improved temperature and power
cycling capability
• High power density
• Small and light weight
1) CoolMOS is a trademark of Infineon Technologies AG.
POWERSEM GmbH, Walpersdorfer Str. 53
 2004 POWERSEM reserves the right to change limits, test conditions and dimensions
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20