PSIG50-06 Datasheet, PDF (1/4 Pages) Powersem GmbH – IGBT Module

IGBT Module
Short Circuit SOA Capability
Square RBSOA
Preliminary Data Sheet
PSIG 50/06
PSI 50/06*
PSIS 50/06*
PSSI 50/06*
ECO-PAC^TM 2
I_C25
= 42.5 A
V_CES = 600 V
V = _CE(sat)typ. 2.4 V
LN 9 S18 A1 JK 10 PSIG
PSIG 50/06
IGBTs
PSI 50/06*
PSSI 50/06*
L9
PSIS 50/06* ^{E 2}
*NTC optional ^{K 10}
X 16
O P 9 _PSI
GH 10
VX 18
X 13
NTC
X 15
Symbol
V_CES
V_GES
I_C25
I_C80
I_CM
V_CEK
t_SC
(SCSOA)
Conditions
Maximum Ratings
T_VJ = 25°C to 150°C
600
V
± 20
V
T_C = 25°C
T_C = 80°C
42.5
A
29
A
V_GE = ±15 V; R_G = 33 Ω; T_VJ = 125°C
60
A
RBSOA, Clamped inductive load; L = 100 µH
V_CES
V_CE = V_CES; V_GE = ±15 V; R_G = 33 Ω; T_VJ = 125°C
non-repetitive
10
µs
X 15
NTC
X 16
L9
F1
L9
T 16
IK 10 _PSSI
RS 18
AC 1
AC 1 _PSIS
P_tot
T_C = 25°C
130
W
X 15
RS 18
Symbol
V_CE(sat)
V_GE(th)
I_CES
I_GES
t_d(on)
t_r
t_d(off)
t_f
E_on
E_off
C_ies
R_thJC
R_thJH
Conditions
Characteristic Values
(T_VJ = 25°C, unless otherwise specified)
min. typ. max.
I_C = 50 A; V_GE = 15 V; T_VJ = 25°C
T_VJ = 125°C
I_C = 0.7 mA; V_GE = V_CE
V_CE = V_CES;
V_GE = 0 V; T_VJ = 25°C
T_VJ = 125°C
V_CE = 0 V; V_GE = ± 20 V
Inductive load, T_VJ = 125°C
V_CE = 300 V; I_C = 30 A
V_GE = 15/0 V; R_G = 33 Ω
2.4 2.9 V
2.9
V
4.5
6.5 V
0.6 mA
1.7 mA
100 nA
50
ns
50
ns
270
ns
40
ns
1.4
mJ
1.0
mJ
V_CE = 25 V; V_GE = 0 V; f = 1 MHz
(per IGBT)
with heatsink compound (0.42 K/m.K; 50 µm)
16
1.92
nF
0.96 K/W
K/W
Caution: These Devices are sensitive
to electrostatic discharge. Users should
observe proper ESD handling precautions.
NTC
X 16
IK 10
Features
•
Package with DCB ceramic base plate
•
Isolation voltage 3000 V∼
•
Planar glass passivated chips
•
Low forward voltage drop
•
Leads suitable for PC board
soldering
•
UL registered, E 148688
Applications
•
AC and DC motor control
•
AC servo and robot drives
•
power supplies
•
welding inverters
Advantages
•
Easy to mount with two screws
•
Space and weight savings
•
Improved temperature and power
cycling capability
•
High power density
•
Small and light weight
•
Leads with expansion bend for
stress relief
POWERSEM GmbH, Walpersdorfer Str. 53
© 2002 POWERSEM reserves the right to change limits, test conditions and dimensions
D - 91126 Schwabach
Phone: 09122 - 9764 - 0 FAX: 09122 - 9764 - 20