LNK6774E Datasheet, PDF (1/24 Pages) Power Integrations, Inc. – Energy Efficient, High-Power Off-Line Switcher With Accurate Primary-Side Regulation (PSR)

LinkSwitch^™-HP Family
Energy Efficient, High-Power Off-Line Switcher
With Accurate Primary-Side Regulation (PSR)
Product Highlights
EcoSmart^™- Energy Efficient
• Multi-mode control maximizes efficiency over full load range
• No-load consumption below 30 mW at 230 VAC (LNK67xx)
• >75% efficiency with 1 W input at 230 VAC
• >50% efficiency with 0.1 W input at 230 VAC
High Design Flexibility for Low System Cost
• Dramatically simplifies power supply designs
• Eliminates optocoupler and all secondary control circuitry
• ±5% or better output voltage tolerance
• 132 kHz operation reduces transformer and power supply size
• Accurate programmable current limit
• Compensation over line limits overload power
• Frequency jittering reduces EMI filter cost
• Fully integrated soft-start for minimum start-up stress
• 725 V MOSFET simplifies meeting derating requirements
(LNK677x)
• 650 V MOSFET for lowest system cost (LNK676x/LNK666x)
• Fast transient response family option (LNK666x)
Extensive Protection Features
• Auto-restart limits power delivery to 3% during overload faults
• Output short-circuit protection (SCP)
• Output overload/over-current protection (OPP, OCP)
• Optional extended shutdown delay time
• Output overvoltage protection (OVP), auto-restart or latching
• Line brown-in/out protection (line UV)
• Line overvoltage (OV) shutdown extends line surge withstand
• Accurate thermal shutdown (OTP), hysteretic or latching
Advanced Green Package Options
• eSIP^™-7C package:
• Vertical orientation for minimum PCB footprint
• Simple heat sink mounting using clip or adhesive pad
• eSOP^™-12B package:
• Low profile surface mounted for ultra-slim designs
• Heat transfer to PCB via exposed pad and SOURCE pins
• Supports either wave or IR reflow soldering
• eDIP^™-12B package:
• Low profile through-hole mounted for ultra-slim designs
• Heat transfer to PCB via exposed pad or optional metal heat sink
• Extended creepage to DRAIN pin
• Heat sink is connected to SOURCE for low EMI
• Halogen free and RoHS compliant
Typical Applications
• LCD Monitor and TV
• Adapter
• Appliances
• Embedded power supplies (DVD, set-top box)
• Industrial
CONTROL
Figure 1. Typical Application Schematic.
Exposed
Pad
Exposed
Pad
eSIP-7C (E Package)
eSOP-12B (K Package)
eDIP-12B (V Package)
Figure 2. Package Options.
Output Power Table
Product⁴
230 VAC ±15%
Heat Sink
Adapter
Open
Frame
85-265 VAC
Adapter
Open
Frame
LNK6xx3K/V
LNK6xx3K
LNK6xx3E
LNK6xx4K/V
LNK6xx4K
LNK6xx4E
LNK6xx5K/V
LNK6xx5K
LNK6xx5E
LNK6xx6K/V
LNK6xx6K
LNK6xx6E
LNK6xx7K/V
LNK6xx7K
LNK6xx7E
PCB-W¹
PCB-R²
Metal
PCB-W¹
PCB-R²
Metal
PCB-W¹
PCB-R²
Metal
PCB-W¹
PCB-R²
Metal
PCB-W¹
PCB-R²
Metal
15 W
21 W
21 W
16 W
22 W
30 W
19 W
26 W
40 W
21 W
30 W
60 W
25 W
36 W
85³ W
25 W
35 W
35 W
28 W
39 W
47 W
30 W
42 W
59³ W
34 W
48 W
88³ W
41 W
59 W
117³ W
9W
12 W
13 W
11 W
15 W
20 W
13 W
18 W
26 W
15 W
22 W
40 W
19 W
27 W
55 W
15 W
21 W
27 W
20 W
28 W
36 W
22 W
31 W
45 W
26 W
37 W
68³ W
30 W
43 W
90³ W
Table 1. Output Power Table.
Notes:
1. PCB heat sink with wave soldering.
2. PCB heat sink with IR reflow soldering (exposed pad thermally connected to PCB).
3. Maximum power specified based on proper thermal dissipation.
4. Packages: E: eSIP-7C, K: eSOP-12B, V: eDIP-12B. See Table 2 for all device options.
www.powerint.com
This Product is Covered by Patents and/or Pending Patent Applications.
March 2014