CM300DX-34SA Datasheet, PDF (4/9 Pages) Powerex Power Semiconductors – Dual IG NX-Series Module 300 Amperes/1700 Volts

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CM300DX-34SA
Dual IGBT NX-Series Module
300 Amperes/1700 Volts
Electrical Characteristics, T_j = 25°C unless otherwise specified (continued)
NTC Thermistor Part
Characteristics
Zero Power Resistance
Deviation of Resistance
B Constant
Power Dissipation
Symbol
R₂₅
∆R/R
B_(25/50)
P₂₅
Test Conditions
T_C = 25°C^*2
T_C = 100°C, R₁₀₀ = 493Ω
Approximate by Equation^*7
T_C = 25°C^*2
Min.
Typ.
Max. Units
4.85 5.00 5.15
kΩ
-7.3
—
+7.8
%
—
3375
—
K
—
—
10
mW
Thermal Resistance Characteristics
Thermal Resistance, Junction to Case^*2
Thermal Resistance, Junction to Case^*2
Contact Thermal Resistance,
Case to Heatsink^*2
R_th(j-c)Q
R_th(j-c)D
R_th(c-f)
Per Inverter IGBT
Per Inverter FWDi
Thermal Grease Applied
(Per 1 Module)^*8
—
—
0.05
K/W
—
—
0.08
K/W
—
15
—
K/kW
Mechanical Characteristics
Mounting Torque
Creepage Distance
Clearance
Weight
Flatness of Baseplate
M_t
Mounting to Heatsink, M6 Screw
31
35
40
in-lb
M_s
Mounting to Heatsink, M5 Screw
22
27
31
in-lb
d_s
Terminal to Terminal
17.0
—
—
mm
Terminal to Baseplate
16.8
—
—
mm
d_a
Terminal to Terminal
10.0
—
—
mm
Terminal to Baseplate
10.0
—
—
mm
m
—
350
— Grams
e_c
On Centerline X, Y^*5
±0
—
+100
µm
Recommended Operating Conditons, T_a = 25°C
(DC) Supply Voltage
V_CC
Applied Across C1-E2
Gate (-Emitter Drive) Voltage
V_GE(on)
Applied Across G1-Es1 / G2-Es2
External Gate Resistance
R_G
Per Switch
*2 Case temperature (T_C) and heatsink temperature (T_s) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*5 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
*7
B_(25/50) = In(RR₅₂₀₅)/(T₂¹₅
1
– _T50
)
R₂₅; Resistance at Absolute Temperature T₂₅ [K]; T₂₅ = 25 [°C] + 273.15 = 298.15 [K]
R₅₀; Resistance at Absolute Temperature T₅₀ [K]; T₅₀ = 50 [°C] + 273.15 = 323.15 [K]
*8 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
Di2 Tr2
Di2 Tr2
Th
Di1 Di1
Tr1 Tr1
—
13.5
0
LABEL SIDE
1000
15.0
—
46.4
35.4
32.4
23.0
21.2
0
1200
16.5
27
Volts
Volts
Ω
MOUNTING SIDE
MOUNTING SIDE
Y
MOUNTING
X SIDE
– : CONCAVE
+ : CONVEX
Tr1, Tr2: IGBT, Di1, Di2: FWDi, Th: NTC Thermistor
Each mark points to the center position of each chip.
4
12/12 Rev. 1