CM15TF-12H Datasheet, PDF (2/4 Pages) Mitsubishi Electric Semiconductor – MEDIUM POWER SWITCHING USE INSULATED TYPE

Powerex, Inc., 200 Hillis Street, Youngwood, Pennsylvania 15697-1800 [phone]
CM15TF-12H
Six-IGBT IGBTMOD™ H-Series Module
15 Amperes/600 Volts
Absolute Maximum Ratings, T_j = 25 °C unless otherwise specified
Ratings
Symbol
Junction Temperature
Storage Temperature
Collector-Emitter Voltage (G-E SHORT)
Gate-Emitter Voltage
Collector Current
Peak Collector Current
Diode Forward Current
Diode Forward Surge Current
Power Dissipation
Max. Mounting Torque M5 Mounting Screws
T_j
T_stg
V_CES
V_GES
I_C
I_CM
I_F
I_FM
P_d
–
Module Weight (Typical)
–
V Isolation
V_RMS
* Pulse width and repetition rate should be such that device junction temperature does not exceed the device rating.
Static Electrical Characteristics, T_j = 25 °C unless otherwise specified
Characteristics
Symbol
Test Conditions
Collector-Cutoff Current
Gate Leakage Current
Gate-Emitter Threshold Voltage
Collector-Emitter Saturation Voltage
Total Gate Charge
Diode Forward Voltage
I_CES
I_GES
V_GE(th)
V_CE(sat)
Q_G
V_FM
V_CE = V_CES, V_GE = 0V
V_GE = V_GES, V_CE = 0V
I_C = 1.5mA, V_CE = 10V
I_C = 15A, V_GE = 15V
I_C = 15A, V_GE = 15V, T_j = 150°C
V_CC = 300V, I_C = 15A, V_GS = 15V
I_E = 15A, V_GS = 0V
** Pulse width and repetition rate should be such that device junction temperature rise is negligible.
Dynamic Electrical Characteristics, T_j = 25 °C unless otherwise specified
Characteristics
Symbol
Test Conditions
Input Capacitance
C_ies
Output Capacitance
C_oes
V_GE = 0V, V_CE = 10V, f = 1MHz
Reverse Transfer Capacitance
C_res
Resistive
Turn-on Delay Time
Load
Rise Time
Switch
Turn-off Delay Time
Times
Fall Time
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
t_d(on)
t_r
t_d(off)
t_f
t_rr
Q_rr
V_CC = 300V, I_C = 15A,
V_GE1 = V_GE2 = 15V, R_G = 42Ω
I_E = 15A, di_E/dt = –30A/µs
I_E = 15A, di_E/dt = –30A/µs
Thermal and Mechanical Characteristics, T_j = 25 °C unless otherwise specified
Characteristics
Symbol
Test Conditions
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Contact Thermal Resistance
R_th(j-c)
R_th(j-c)
R_th(c-f)
Per IGBT
Per FWDi
Per Module, Thermal Grease Applied
CM15TF-12H
–40 to +150
–40 to +125
600
±20
15
30*
15
30*
100
17
150
2500
Units
°C
°C
Volts
Volts
Amperes
Amperes
Amperes
Amperes
Watts
in-lb
Grams
Volts
Min.
Typ.
Max. Units
–
–
1.0
mA
–
–
0.5
µA
4.5
6.0
7.5
Volts
–
2.1
2.8** Volts
–
2.15
–
Volts
–
45
–
nC
–
–
2.8
Volts
Min.
Typ.
Max. Units
–
–
1.5
nF
–
–
0.5
nF
–
–
0.3
nF
–
–
120
ns
–
–
300
ns
–
–
200
ns
–
–
300
ns
–
–
110
ns
–
0.04
–
µC
Min.
Typ.
Max. Units
–
–
1.30 °C/W
–
–
3.50 °C/W
–
–
0.092 °C/W
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