QID3330001 Datasheet, PDF (1/6 Pages) Powerex Power Semiconductors – Dual IGBT HVIGBT Module 300 Amperes/3300 Volts

Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 [phone]
www.pwrx.com
QID3330001
Dual IGBT
HVIGBT Module
300 Amperes/3300 Volts
S NUTS
(3TYP)
A
D
F
F
J (2TYP)
C
N
BE
1
2
3
H
M
H
G (3TYP)
T (SCREWING
DEPTH)
R (DEEP)
K
(3TYP)
L
(2TYP)
V (4TYP)
U (5TYP)
P
Q
4
1
5
6
2
8
7
3
Outline Drawing and Circuit Diagram
Dimensions
Inches
Millimeters
A
5.51
140.0
B
2.87
73.0
C
1.89
48.0
D
4.88±0.01
124.0±0.25
E
2.24±0.01
57.0±0.25
F
1.18
30.0
G
0.43
11.0
H
1.07
27.15
J
0.20
5.0
K
1.65
42.0
Dimensions
L
M
N
P
Q
R
S
T
U
V
Inches
0.69±0.01
0.38
0.20
0.22
1.44
0.16
M6 Metric
0.63 Min.
0.11 x 0.02
0.28 Dia.
Millimeters
17.5±0.25
9.75
5.0
5.5
36.5
4.0
M6
16.0 Min.
2.8 x 0.5
7.0 Dia.
Description:
Powerex HVIGBTs feature highly
insulating housings that offer
enhanced protection by means of
greater creepage and strike clear-
ance distance for many demanding
applications like medium voltage
drives and auxiliary traction
applications.
Features:
 -40 to 150°C Extended 
Temperature Range
 100% Dynamic Tested
 100% Partial Discharge Tested
 Advanced Mitsubishi R-Series
Chip Technology
 Aluminum Nitride (AlN) Ceramic
Substrate for Low Thermal
Impedance
 Complementary Line-up in
Expanding Current Ranges to
Mitsubishi HVIGBT Power
Modules
 Copper Baseplate
 Creepage and Clearance Meet
IEC 60077-1
 Rugged SWSOA and RRSOA
Applications:
 High Voltage Power Supplies
 Medium Voltage Drives
 Motor Drives
 Traction
07/14 Rev. 2
1