LP3315 Datasheet, PDF (7/8 Pages) Lowpower Semiconductor inc – 1.2MHzFixed-Frequency PWM Operation

Preliminary Datasheet
LP3315
junction to ambient thermal resistance.
For the recommended operating conditions specification of LP3315, the maximum junction temperature of the die
is 125°C. The junction to ambient thermal resistance Qja is layout dependent. The junction to ambient thermal
resistance for SOT23-5 package is 255°C/W and for WDFN-8L 2x2 package is 165°C/W on the standard JEDEC
51-3 single layer thermal test board. The maximum power dissipation at TA = 25°C can be calculated by
following formula :
Layout Consideration
For best performance of the LP3315, the following
guidelines must be strictly followed.
- Input and Output capacitors should be placed close to the IC and connected to ground plane to reduce noise
coupling.
- The GND and Exposed Pad should be connected to a strong ground plane for heat sinking and noise protection.
- Keep the main current traces as possible as short and wide.
- LX node of DC-DC converter is with high frequency voltage swing. It should be kept at a small area.
- Place the feedback components as close as possible to the IC and keep away from the noisy devices.
LP3315– 00 Version1.0 Datasheet Feb.-2012
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