YS12S16 Datasheet, PDF (1/5 Pages) Power-One – YS12S16 DC-DC Converter Data Sheet 9.6-14 VDC Input; 0.7525-5.5 VDC Programmable @ 16A

YS12S16 DC-DC Converter Data Sheet
9.6-14 VDC Input; 0.7525-5.5 VDC Programmable @ 16A
Applications
• Intermediate Bus Architectures
• Telecommunications
• Data communications
• Distributed Power Architectures
• Servers, workstations
Benefits
• High efficiency – no heat sink required
• Reduces total solution board area
• Tape and reel packing
• Compatible with pick & place equipment
• Minimizes part numbers in inventory
• Low cost
The
Products: Y-Series
Features
• RoHS lead-free solder and lead-solder-exempted
products are available
• Delivers up to 16 A (88 W)
• Extended input range 9.6 V – 14 V
• High efficiency (0.948 at 5 V output)
• Surface-mount package
• Industry-standard footprint and pinout
• Small size and low profile: 1.30” x 0.53” x 0.314”
(33.02 x 13.46 x 7.98 mm)
• Weight: 0.23 oz [6.50 g]
• Coplanarity less than 0.003”, maximum
• Synchronous Buck Converter topology
• Start-up into pre-biased output
• No minimum load required
• Programmable output voltage via external resistor
• Operating ambient temperature: -40 °C to 85 °C
• Remote output sense
• Remote ON/OFF (positive or negative)
• Fixed-frequency operation
• Auto-reset output overcurrent protection
• Auto-reset overtemperature protection
• High reliability, MTBF approx. 27.2 Million Hours
calculated per Telcordia TR-332, Method I Case 1
• All materials meet UL94, V-0 flammability rating
• UL 60950 recognition in U.S. & Canada, and
DEMKO certification per IEC/EN 60950
Description
The YS12S16 non-isolated DC-DC converters deliver up to 16 A of output current in an industry-standard surface-
mount package. Operating from a 9.6-14 VDC input, the YS12S16 converters are ideal choices for Intermediate
Bus Architectures where point-of-load power delivery is generally a requirement. They provide an extremely tight
regulated programmable output voltage of 0.7525 V to 5.5 V.
The YS12S16 converters provide exceptional thermal performance, even in high temperature environments with
minimal airflow. This is accomplished through the use of advanced circuitry, packaging, and processing
techniques to achieve a design possessing ultra-high efficiency, excellent thermal management and a very low
body profile.
The low body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.
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