YNC12S20 Datasheet, PDF (1/28 Pages) Power-One – 9.6-14 VDC Input; 0.7525-5.5 VDC Programmable 20 A

YNC12S20 DC-DC Converter Data Sheet
9.6-14 VDC Input; 0.7525-5.5 VDC Programmable @ 20 A
The
Products: Y-Series
Applications
• Intermediate Bus Architectures
• Telecommunications
• Data communications
• Distributed Power Architectures
• Servers, workstations
Benefits
• High efficiency – no heat sink required
• Reduces total solution board area
• Tape and reel packing
• Compatible with pick & place equipment
• Minimizes part numbers in inventory
Description
Features
• RoHS lead-free solder and lead-solder-exempted
products are available
• Delivers up to 20 A (100 W)
• Extended input range 9.6 V – 14 V
• High efficiency (0.94 at 5 V output)
• Surface-mount package
• Industry-standard footprint and pinout
• Small size and low profile: 1.30” x 0.53” x 0.314”
(33.02 x 13.46 x 7.98 mm)
• Weight: 0.22 oz [6.12 g]
• Coplanarity less than 0.003”, maximum
• Synchronous Buck Converter topology
• Source and sink capable
• Start-up into pre-biased output
• No minimum load required
• Programmable output voltage via external resistor
• Operating ambient temperature: -40 °C to 85 °C
• Remote output sense
• Remote ON/OFF (Positive or Negative)
• Fixed-frequency operation
• Auto-reset output overcurrent protection
• Auto-reset overtemperature protection
• High reliability, MTBF = TBD Million Hours
• All materials meet UL94, V-0 flammability rating
• UL 60950 recognition in U.S. & Canada, and DEMKO
certification per IEC/EN 60950
The YNC12S20 non-isolated DC-DC converter delivers up to 20 A of output current in an industry-standard
surface-mount package. Operating from a 9.6 to 14 VDC input, the YNC12S20 converter is an ideal choice
for Intermediate Bus Architectures where point-of-load power delivery is generally a requirement. It provides a
resistor-programmable regulated output voltage of 0.7525V to 5.5V.
The Y-Series converters provide exceptional thermal performance, even in high temperature environments
with minimal airflow. This is accomplished through the use of circuit, packaging and processing techniques to
achieve ultra-high efficiency, excellent thermal management and a very low body profile.
The low body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.
OCT 12, 2006 revised to APR 23, 2007
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