PAS6352 Datasheet, PDF (16/16 Pages) Pixart Imaging Inc. – CMOS VGA IMAGE SENSOR

PixArt Imaging Inc.
PAS6352
CMOS Image Sensor IC
Recommended Guideline for PCB Assembly
Recommended vender and type for Pb-free solder paste
1. Almit LFM-48W TM-HP
2. Senju M705-GRN360-K
IR Reflow Soldering Profile:
Temperature profile is the most important control in reflow soldering. It must be fine tuned to establish
a robust process. The typical recommended IR reflow profile is showed in figure below.
IR Reflow Profile
Reflow Profile :
1. Average Ramp-up Rate (30°C to preheat zone): 1.5~ 2.5 Degree C/ Sec
2. Preheat zone:
2.1 Temp ramp from 170~ 200 degree C
2.2 Exposure time: 90 +/- 30 sec
3. Melting zone:
3.1 Melting area temp > 220 degree C for at least 30 ~ 50 sec
3.2 Peak temperature : 245 degree C.
Others:
Epoxy under-filled process is required post IC mounting process.
☉ Dispense Epoxy
Epoxy
Epoxy Under-filled
All rights strictly reserved any portion in this paper shall not be reproduced, copied or transformed to any other forms without permission.
PixArt Imaging Inc.
E-mail: [e-mail]
V0.6,
16
2012/11/13