TDA8395 Datasheet, PDF (9/10 Pages) NXP Semiconductors – SECAM decoder

Philips Semiconductors
SECAM decoder
PACKAGE OUTLINE
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
Preliminary specification
TDA8395
SOT38-1
D
L
Z
e
b
16
pin 1 index
A_{2 A}
A₁
wM
b₁
9
M_E
c
(e ₁)
M_H
E
1
8
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
c
D ⁽¹⁾
E ⁽¹⁾
e
mm
4.7
0.51
3.7
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
2.54
inches
0.19
0.020
0.15
0.055 0.021 0.013
0.045 0.015 0.009
0.86
0.84
0.26
0.24
0.10
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
e₁
7.62
0.30
L
3.9
3.4
0.15
0.13
M_E
8.25
7.80
0.32
0.31
M_H
w
Z ⁽¹⁾
max.
9.5
8.3
0.254
2.2
0.37
0.33
0.01 0.087
OUTLINE
VERSION
SOT38-1
IEC
050G09
REFERENCES
JEDEC
EIAJ
MO-001AE
EUROPEAN
PROJECTION
ISSUE DATE
92-10-02
95-01-19
October 1991
9