PESD5V0V1BCSF_15 Datasheet, PDF (9/13 Pages) NXP Semiconductors – Ultra low profile bidirectional very low capacitance

NXP Semiconductors
PESD5V0V1BCSF
Bidirectional very low capacitance ESD protection diode
9. Packing information
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.^[1]
Type number
Package Description
PESD5V0V1BCSF SOD962 2 mm pitch, 8 mm tape and reel
[1] For further information and the availability of packing methods, see Section 13.
10. Soldering
Packing quantity
9 000
-315
Footprint information for reflow soldering of leadless ultra small package; 2 terminals
SOD962
0.85
0.4
R0.025 (8×)
0.4
0.22
(2×)
0.12
(2×)
0.2
(2×)
solder land
solder paste deposit
solder land plus solder paste
solder resist
Dimensions in mm
sod962_fr
Reflow soldering is the required soldering method.
Fig 10. Required reflow soldering footprint PESD5V0V1BCSF (SOD962)
Based on results of board mount testing, NXP Semiconductors requires the following
soldering guidelines:
1. Soldering footprint as indicated in Figure 10: solder paste has to cover the whole
solder land area.
2. Non-solder mask defined (copper-defined) solder lands.
3. Minimum stencil thickness of 100 m.
4. Paste type 4 or smaller sphere size.
5. Pick and placement accuracy of 50 m.
PESD5V0V1BCSF
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 2 September 2011
© NXP B.V. 2011. All rights reserved.
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