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P3Z22V1 Datasheet, PDF (9/16 Pages) NXP Semiconductors – 3V zero power, TotalCMOS, universal PLD device
Philips Semiconductors
3V zero power, TotalCMOS™, universal PLD device
Product specification
P3Z22V10
DC ELECTRICAL CHARACTERISTICS FOR COMMERCIAL GRADE DEVICES
Commercial: 0°C ≤ Tamb ≤ +70°C; 3.0 ≤ VDD ≤ 3.6V
SYMBOL
PARAMETER
TEST CONDITIONS
MIN.
LIMITS
TYP.
MAX.
UNITS
VIL
VIH
VI
VOL
VOH
II
IOZ
IDDQ
IDDD 1
ISC
Input voltage low
VDD = 3.0V
Input voltage high
VDD = 3.6V
2
Input clamp voltage
VDD = 3.0V; IIN = –18mA
Output voltage low
VDD = 3.0V; IOL = 8mA
Output voltage high
VDD = 3.0V; IOH = –4mA
2.4
Input leakage current
VIN = 0 to VDD
–10
VIN = VDD to 5.5V2
–10
3-Stated output leakage current
VIN = 0 to VDD
VIN = VDD to 5.5V2
–10
–10
Standby current
VDD = 3.6V; Tamb = 0°C
Dynamic current
VDD = 3.6V; Tamb = 0°C @ 1MHz
VDD = 3.6V; Tamb = 0°C @ 50MHz
Short circuit output current
1 pin/time for no longer than 1 se-
cond
–15
0.8
V
V
–1.2
V
0.5
V
V
10
µA
10
10
µA
10
25
45
µA
.5
2
mA
10
15
mA
–100
mA
CIN
Input pin capacitance
Tamb = 25°C; f = 1MHz
8
pF
CCLK
Clock input capacitance
Tamb = 25°C; f = 1MHz
5
12
pF
CI/O
I/O pin capacitance
Tamb = 25°C; f = 1MHz
10
pF
NOTES:
1. These parameters measured with a 10-bit up counter, with all outputs enabled and unloaded. Inputs are tied to VDD or ground. These
parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified where current may be
affected.
2. Does not apply to F7.
AC ELECTRICAL CHARACTERISTICS FOR COMMERCIAL GRADE DEVICES
Commercial: 0°C ≤ Tamb ≤ +70°C; 3.0 ≤ VDD ≤ 3.6V
SYMBOL
PARAMETER
–B
MIN.
MAX.
–D
MIN.
MAX.
UNIT
tPD
Input or feedback to non-registered output
tSU
Setup time from input, feedback or SP to Clock
tCO
Clock to output
tCF
Clock to feedback1
tH
Hold time
tAR
Asynchronous Reset to registered output
tARW
Asynchronous Reset width
tARR
Asynchronous Reset recovery time
tSPR
Synchronous Preset recovery time
tWL
Width of Clock LOW
tWH
Width of Clock HIGH
tR
Input rise time
tF
fMAX1
Input fall time
Maximum internal frequency2 (1/tSU + tCF)
fMAX2
fMAX3
Maximum external frequency1 (1/tSU + tCO)
Maximum clock frequency1 (1/tWL + tWH)
tEA
Input to Output Enable
tER
Input to Output Disable
Capacitance
15
10
ns
4.5
3.5
ns
10
9
ns
6
4.5
ns
0
0
ns
17
17
ns
5
5
ns
6
6
ns
6
6
ns
3
3
ns
3
3
ns
20
20
ns
20
20
ns
95
125
MHz
69
80
MHz
167
167
MHz
9
9
ns
9
9
ns
CIN
Input pin capacitance
10
10
pF
COUT
Output capacitance
10
10
pF
NOTES:
1. These parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified where frequency
may be affected.
2. These parameters measured with a 10-bit up counter, with all outputs enabled and unloaded. Inputs are tied to VDD or ground. These
parameters are not 100% tested, but are calculated at initial characterization and at any time the design is modified where frequency may be
affected.
1997 Jul 18
9