BGY212A Datasheet, PDF (9/11 Pages) NXP Semiconductors – UHF amplifier module

Philips Semiconductors
UHF amplifier module
PACKAGE OUTLINE
Leadless surface mounted package; plastic cap; 4 terminations
e
b
(4×)
1
2
e1
b1 b2
e
d
b2
b3
3
4
b3
L
L1
L2
D
D1
5
A
c
Preliminary specification
BGY212A
SOT482C
pin 1 index
E1 E
0
DIMENSIONS (mm are the original dimensions)
UNIT A
b
b1
b2
b3
c
mm
1.90
1.59
1.9
1.7
1.4
1.2
0.8
0.6
0.6 0.70
0.4 0.57
5
scale
D
D1
d
13.7 13.35
13.3 13.05
2.0
10 mm
E
E1
e
8.2 7.85 2.6
7.8 7.55 2.4
e1
L
L1
L2
4.6 1.15 2.65 3.85
4.4 0.85 2.35 3.55
OUTLINE
VERSION
IEC
SOT482C
1999 Aug 23
REFERENCES
JEDEC
EIAJ
9
EUROPEAN
PROJECTION
ISSUE DATE
99-05-18
99-08-16