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TDA8551_T_15 Datasheet, PDF (8/18 Pages) NXP Semiconductors – 1 W BTL audio amplifier with digital volume control
NXP Semiconductors
1 W BTL audio amplifier with digital volume
control
Product specification
TDA8551
TEST AND APPLICATION INFORMATION
handbook, full pagewidth
VP
volume
control
UP
DOWN
R1
2.2 kΩ C5
100 nF
C1 IN 4
330 nF
UP/DOWN
VP
1
6
VOLUME
CONTROL
VP
C3
100
MASTER
nF
8 OUT+
20 kΩ
Vi
VP
standby
mute
TDA8551
SVR 3
C2
100
μF
STANDBY/
MUTE/
OPERATING
2
MODE
15 kΩ
5 kΩ
R
R
15 kΩ
8Ω
5 OUT−
7
GND
SLAVE
operating
VP = 5 V
C4
220
μF
MGM560
Fig.4 Test and application circuit.
Reduction of the value of capacitor C2 results in a
decrease of the SVRR performance at low frequencies
(see Fig.9).
The UP/DOWN pin can be driven by a 3-state logic output
stage (microcontroller) without extra external components.
If the UP/DOWN pin is driven by push-buttons, then it is
advised to have an RC filter between the buttons and the
UP/DOWN pin. Advised values for the RC filter are 2.2 kΩ
and 100 nF.
The volume control circuit responds to the trailing edge of
the pulse on the volume pin; connecting to VP results in a
one step (1.25 dB) higher gain; connecting to ground
results in a one step lower gain.
To avoid audible plops while switching the supply voltage
on and off pin MODE has to be connected to VP (standby
condition) during charge or discharge of the input and
SVRR capacitors.
The measured thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different semiconductor manufacturers because the
application boards and test methods are not standardized
yet. In addition, the thermal performance of packages for a
specific application may be different than presented here,
because the configuration of the application boards
(copper area) may be different. NXP Semiconductors uses
FR-4 type application boards with 1 oz. copper traces with
solder coating. The measurements have been carried out
with vertical placed boards.
1998 Feb 23
8