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TDA5051 Datasheet, PDF (8/28 Pages) NXP Semiconductors – Home automation modem
Philips Semiconductors
Home automation modem
Product specification
TDA5051
SYMBOL
PARAMETER
CONDITIONS
MIN.
Transmission mode
fcr
carrier frequency
tsu
set-up time of the shaped
burst
th
hold time of the shaped burst
tW(DI)(min)
Vo(rms)
Io(max)
Zo
VO
THD
minimum pulse width of
DATAIN signal
output carrier signal (RMS
value)
power amplifier maximum
output current (peak value)
output impedance of the
power amplifier
output DC level at TXOUT
total harmonic distortion on
CISPR16 load with the
coupling network
(measured on the first ten
harmonics)
B−20dB
bandwidth of the shaped
output signal (at −20 dB) on
CISPR16 load with the
coupling network
fosc = 8.48 MHz −
fosc = 8.48 MHz; −
see Fig.8
fosc = 8.48 MHz; −
see Fig.8
fosc = 8.48 MHz; −
see Fig.8
ZL = CISPR16
120
DATAIN = LOW
ZL = 1 Ω;
−
DATAIN = LOW
−
−
Vo(rms) = 121 dBµ −
V on CISPR16
load;
fosc = 8.48 MHz;
DATAIN = LOW
(no modulation);
see Figs 3 and 16
Vo(rms) = 121 dBµ −
V on CISPR16
load;
fosc = 8.48 MHz;
DATAIN = 300 Hz;
duty factor = 50%;
see Fig.4
Reception mode
Vi(rms)
analog input signal (RMS
68
value)
VI
Zi
RAGC
tc(AGC)
DC level at pin RXIN
−
RXIN input impedance
−
automatic gain control range
−
automatic gain control time
constant
fosc = 8.48 MHz; −
see Fig.5
td(dem)(su)
demodulation delay set-up
time
fosc = 8.48 MHz; −
see Fig.15
td(dem)(h)
demodulation delay hold time fosc = 8.48 MHz; −
see Fig.15
Bdet
detection bandwidth
fosc = 8.48 MHz −
TYP.
MAX.
132.5 −
170
−
170
−
190
−
−
122
160
−
5
−
2.5
−
−55
−
3000 −
−
122
2.5
−
50
−
36
−
296
−
410
460
330
380
3
−
UNIT
kHz
µs
µs
µs
dBµV
mA
Ω
V
dB
Hz
dBµV
V
kΩ
dB
µs
µs
µs
kHz
1997 Sep 19
8