TDA2549 Datasheet, PDF (8/9 Pages) NXP Semiconductors – I.F. amplifier and demodulator for multistandard TV receivers

Philips Semiconductors
I.F. amplifier and demodulator for
multistandard TV receivers
PACKAGE OUTLINE
DIP24: plastic dual in-line package; 24 leads (600 mil)
Product specification
TDA2549
SOT101-1
D
L
Z
e
24
pin 1 index
A_{2 A}
A₁
wM
b₁
b
13
M_E
c
(e ₁)
M_H
E
1
12
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
c
D ⁽¹⁾
E ⁽¹⁾
e
e₁
L
M_E
M_H
w
Z ⁽¹⁾
max.
mm
5.1 0.51 4.0
1.7
1.3
0.53 0.32
0.38 0.23
32.0
31.4
14.1
13.7
2.54 15.24
3.9
3.4
15.80 17.15
15.24 15.90
0.25
2.2
inches
0.20
0.020
0.16
0.066 0.021 0.013
0.051 0.015 0.009
1.26
1.24
0.56
0.54
0.10
0.60
0.15
0.13
0.62
0.60
0.68
0.63
0.01 0.087
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT101-1
IEC
051G02
REFERENCES
JEDEC
EIAJ
MO-015AD
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-01-23
April 1985
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