SA5214 Datasheet, PDF (8/10 Pages) NXP Semiconductors – Postamplifier with link status indicator

Philips Semiconductors
Postamplifier with link status indicator
Product specification
SA5214
All die are 100% functional with various parametrics tested at the
wafer level, at room temperature only (25°C), and are guaranteed to
be 100% functional as a result of electrical testing to the point of
wafer sawing only. Although the most modern processes are
utilized for wafer sawing and die pick and place into waffle pack
carriers, it is impossible to guarantee 100% functionality through this
process. There is no post waffle pack testing performed on
individual die.
Since Philips Semiconductors has no control of third party
procedures in the handling or packaging of die, Philips
Semiconductors assumes no liability for device functionality or
performance of the die or systems on any die sales.
Although Philips Semiconductors typically realizes a yield of 85%
after assembling die into their respective packages, with care
customers should achieve a similar yield. However, for the reasons
stated above, Philips Semiconductors cannot guarantee this or any
other yield on any die sales.
THRESH
LED
C_PKDET
2
1
IN1B
IN1A
20
19
CAZP
GNDA
3
18
CAZN
4
FLAG
5
6
JAM
7
ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ
17
16
15
14
OUT1B
IN2B
8
13
V_CCD
V_CCA
ECN No.: 94620
1988 Sep 28
1998 Oct 07
9
10
GNDD
V_OUT
11
12
R_HYST
R_PKDET
IN2A
Figure 6. SA5214 Bonding Diagram
8
OUT1A
SD00490