BLT52 Datasheet, PDF (8/12 Pages) NXP Semiconductors – UHF power transistor

Philips Semiconductors
UHF power transistor
Product specification
BLT52
MOUNTING RECOMMENDATIONS
Both the metallized groundplate and leads contribute to the heatflow. It is recommended that the transistor is mounted
on a grounded metallized area of a maximum thickness of 0.8 mm on the printed-circuit board, equipped with at least 12
(0.5 mm diameter) through metallized holes filled with solder.
A thermal resistance R_th(mb-h) of 5 K/W can be achieved if heatsink compound is applied when the transistor is mounted
on the printed-circuit board.
full pagewidth
7.38 3.60
1.87 (2×)
0.60 (4×)
0.80 (2×)
0.50 (12×)
1.00 (8×)
Dimensions in mm.
1.00 (9×)
4.60
MGK390
Fig.15 Reflow soldering footprint for SOT409A.
1998 Jan 28
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