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BAT46WJ_15 Datasheet, PDF (8/12 Pages) NXP Semiconductors – Single Schottky barrier diode | |||
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NXP Semiconductors
9. Package outline
BAT46WJ
Single Schottky barrier diode
1.35
1.15
1
2.7 1.8
2.3 1.6
0.80
0.65
0.5
0.3
Dimensions in mm
2
0.40
0.25
Fig 12. Package outline SOD323F (SC-90)
0.25
0.10
04-09-13
10. Packing information
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
BAT46WJ
SOD323F 4 mm pitch, 8 mm tape and reel
Packing quantity
3 000
10 000
-115
-135
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
3.05
2.2
2.1
1.65 0.95
0.5 (2Ã) 0.6 (2Ã)
0.5
(2Ã)
0.6
(2Ã)
Reflow soldering is the only recommended soldering method.
Fig 13. Reflow soldering footprint SOD323F (SC-90)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sod323f_fr
BAT46WJ
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 â 8 November 2011
© NXP B.V. 2011. All rights reserved.
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