SAA55XX Datasheet, PDF (75/84 Pages) NXP Semiconductors – TV microcontrollers with Closed Captioning (CC) and On-Screen Display (OSD)

Philips Semiconductors
TV microcontrollers with Closed Captioning (CC)
and On-Screen Display (OSD)
Preliminary specification
SAA55xx
22 QUALITY AND RELIABILITY
This device will meet Philips Semiconductors General Quality Specification for Business group “Consumer Integrated
Circuits SNW-FQ-611-Part E”. The principal requirements are shown in Tables 30 to 33.
Table 30 Acceptance tests per lot
TEST
Mechanical
Electrical
cumulative target: <80 ppm
cumulative target: <100 ppm
REQUIREMENTS
Table 31 Processability tests (by package family)
TEST
Solderability
Mechanical
Solder heat resistance
0/16 on all lots
0/15 on all lots
0/15 on all lots
REQUIREMENTS
Table 32 Reliability tests (by process family)
TEST
Operational life
Humidity life
Temperature cycling
performance
CONDITIONS
168 hours at T_j = 150 °C
temperature, humidity, bias 1000 hours,
85 °C, 85% RH (or equivalent test)
T_stg(min) to T_stg(max)
REQUIREMENTS
<1000 FPM at T_j = 150 °C
<2000 FPM
<2000 FPM
Table 33 Reliability tests (by device type)
TEST
ESD and latch-up
CONDITIONS
REQUIREMENTS
ESD Human body model 100 pF, 1.5 kW 2000 V
ESD Machine model 200 pF, 0 W
200 V
latch-up
100 mA, 1.5 × V_DD (absolute maximum)
Notes to Tables 30 to 33
1. ppm = fraction of defective devices, in parts per million.
2. FPM = fraction of devices failing at test condition, in Failures Per Million.
3. FITS = Failures In Time Standard.
2000 Feb 23
75