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TDA8444 Datasheet, PDF (7/16 Pages) NXP Semiconductors – Octuple 6-bit DACs with I2C-bus
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Philips Semiconductors
Octuple 6-bit DACs with I2C-bus
Product specification
TDA8444; TDA8444T;
TDA8444AT
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
thermal resistance from junction to ambient
TDA8444
TDA8444T
TDA8444AT
Note
1. When mounted on a Printed-Circuit Board (PCB).
CONDITIONS
in free air
note 1
note 1
VALUE
75
100
85
UNIT
K/W
K/W
K/W
CHARACTERISTICS
VCC = 12 V; Tamb = 25 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
Supply
VCC
ICC
P
Vrst
Pin VMAX
Vi(VMAX)
Ii
supply voltage
supply current
power dissipation
power reset voltage
input effective voltage
input current
Pins SDA and SCL
VI
input voltage
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
IIL
LOW-level input current
IIH
HIGH-level input current
PIN SDA
VOL
Io(sink)
LOW-level output voltage
output sink current
Address bits (A0 to A2)
VI
input voltage
VIL
LOW-level input voltage
VIH
HIGH-level input voltage
IIL
LOW-level input current
IIH
HIGH-level input current
4.5
VMAX = VCC = 12 V; 12
data = 00H
−
1
1
VMAX = VCC
−
VMAX = 1 V
−
0
−
3.0
VSDA = VSCL = −0.3 V −
VSDA = VSCL = 6 V −
IL = 3 mA
−
3
0
−
2.2
VAn = VEE
−10
VAn = VCC
−
TYP.
12
14
170
−
−
−
−
−
−
−
−
−
−
8
−
−
−
−15
−
MAX.
UNIT
13.2
V
19
mA
250
mW
4
V
VCC − 2.0 V
10
µA
10
µA
5.5
V
1.0
V
−
V
−10
µA
±10
µA
0.4
V
−
mA
VCC
V
1.0
V
−
V
−
µA
1
µA
1999 Apr 29
7
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