TDA7072A Datasheet, PDF (7/10 Pages) NXP Semiconductors – Single BTL power driver

Philips Semiconductors
Single BTL power driver
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
Objective specification
TDA7072A/AT
SOT97-1
D
L
Z
e
b
8
A_{2 A}
A₁
wM
b₁
b₂
5
pin 1 index
E
M_E
c
(e ₁)
M_H
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
b₂
c
D ⁽¹⁾
E ⁽¹⁾
e
e₁
L
M_E
M_H
w
Z ⁽¹⁾
max.
mm
4.2
0.51
3.2
1.73 0.53
1.14 0.38
1.07 0.36
0.89 0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches _0.17
0.020
0.13
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT97-1
IEC
050G01
REFERENCES
JEDEC
EIAJ
MO-001AN
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-04
July 1994
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