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TDA7052 Datasheet, PDF (7/8 Pages) NXP Semiconductors – 1 W BTL mono audio amplifier
Philips Semiconductors
1 W BTL mono audio amplifier
PACKAGE OUTLINE
DIP8: plastic dual in-line package; 8 leads (300 mil)
Product specification
TDA7052
SOT97-1
D
L
Z
e
b
8
A2 A
A1
wM
b1
b2
5
pin 1 index
E
ME
c
(e 1)
MH
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73 0.53
1.14 0.38
1.07 0.36
0.89 0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches 0.17
0.020
0.13
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT97-1
IEC
050G01
REFERENCES
JEDEC
EIAJ
MO-001AN
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-04
July 1994
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