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TDA6800 Datasheet, PDF (7/10 Pages) NXP Semiconductors – Video modulator circuit
Philips Semiconductors
Video modulator circuit
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
Product specification
TDA6800
TDA6800T
SOT97-1
D
L
Z
e
b
8
A2 A
A1
wM
b1
b2
5
pin 1 index
E
ME
c
(e 1)
MH
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b
b1
b2
c
D (1)
E (1)
e
e1
L
ME
MH
w
Z (1)
max.
mm
4.2
0.51
3.2
1.73 0.53
1.14 0.38
1.07 0.36
0.89 0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches 0.17
0.020
0.13
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.10
0.30
0.14
0.12
0.32
0.31
0.39
0.33
0.01 0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT97-1
IEC
050G01
REFERENCES
JEDEC
EIAJ
MO-001AN
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-04
March 1986
7