TDA4864J Datasheet, PDF (7/16 Pages) NXP Semiconductors – Vertical deflection booster

Philips Semiconductors
Vertical deflection booster
Product specification
TDA4864J; TDA4864AJ
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages referenced to pin GND; unless
otherwise specified.
SYMBOL
V_P1
V_P2
V_FB
V_P3
V_i
V_o(V-OUT)
I_P2
I_o(V-OUT)
I_VFB
I_VP3
T_stg
T_amb
T_j
V_es
PARAMETER
supply voltage 1
supply voltage 2
flyback supply voltage of TDA4864J
flyback generator output voltage of TDA4864AJ
input voltage on
pin INN
pin INP
output voltage on pin V-OUT
supply current 2
output current on pin V-OUT
current during flyback of TDA4864J
current during flyback of TDA4864AJ
storage temperature
ambient temperature
junction temperature
electrostatic discharge voltage on all pins
CONDITIONS MIN.
−
−
−
0
MAX.
40
60
60
V_P1 + 3
UNIT
V
V
V
V
note 1
note 1
note 2
−
V_P1
V
−
V_P1
V
−
62
V
−
±1.5
A
−
±1.5
A
−
±1.5
A
−
±1.5
A
−25
+150 °C
−20
+75
°C
−
150
°C
−300
+300
V
Notes
1. Internally limited by thermal protection; will be activated for T_j ≥ 150 °C.
2. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS VALUE
UNIT
R_th(j-mb)
thermal resistance from junction to mounting base
note 1
6
K/W
Note
1. To minimize the thermal resistance from mounting base to heatsink [R_th(mb-h)] follow the recommended mounting
instruction: screw mounting preferred; torque = 40 Ncm; use heatsink compound; isolation plate increases R_th(mb-h).
2003 Oct 31
7