TDA4863J Datasheet, PDF (7/20 Pages) NXP Semiconductors – Vertical deflection booster

Philips Semiconductors
Vertical deflection booster
Product specification
TDA4863J; TDA4863AJ
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages referenced to ground (pin 4); unless
otherwise specified.
SYMBOL
V_P1
V_P2
V_FB
V_P3
V_i(6,7)
V_o(5)
I_P2
I_o(5)
I₂
T_stg
T_amb
T_j
V_es
PARAMETER
CONDITIONS MIN.
supply voltage 1 (pin 1)
−
supply voltage 2 (pin 3)
−
flyback supply voltage of TDA4863J (pin 2)
−
flyback generator output voltage of TDA4863AJ (pin 2)
0
input voltage on pins 6 and 7
−
output voltage on pin 5
−
supply current 2 (pin 3)
−
output current (pin 5)
note 1
−
flyback current on pin 2
−
storage temperature
−25
ambient temperature
−20
junction temperature
note 1
−
electrostatic discharge voltage on all pins
note 2
−300
MAX.
40
60
60
V_P1 + 3
V_P1
62
±1.8
±1.8
±1.8
+150
+75
150
+300
UNIT
V
V
V
V
V
V
A
A
A
°C
°C
°C
V
Notes
1. Internally limited by thermal protection; will be activated for T_j ≥ 150 °C.
2. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS VALUE
UNIT
R_th(j-mb)
thermal resistance from junction to mounting base
note 1
6
K/W
Note
1. To minimize the thermal resistance from mounting base to heatsink [R_th(mb-h)] follow the recommended mounting
instruction: screw mounting preferred; torque = 40 Ncm; use heatsink compound; isolation plate increases R_th(mb-h).
2000 Aug 17
7