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| BYC5DX-500 Datasheet, PDF (7/11 Pages) NXP Semiconductors – Hyperfast power diode | |||
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NXP Semiconductors
8. Package outline
Plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 2-lead TO-220 'full pack'
BYC5DX-500
Hyperfast power diode
SOD113
A
E
A1
P
z
q
m
T
D
HE
L2
j
L1(1)
k
Q
L
1
2
b1
b
wM
c
e
0
10
20 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A A1 b b1
c
D
E
e
HE
max
j
k
L
L 1(1)
L2
max
m
P
Q
mm
4.6
4.0
2.9
2.5
0.9
0.7
1.1
0.9
0.7
0.4
15.8
15.2
10.3
9.7
5.08
19.0
2.7
1.7
0.6 14.4 3.3
0.4 13.5 2.8
0.5
6.5
6.3
3.2
3.0
2.6
2.3
Notes
1. Terminals are uncontrolled within zone L1.
2. z is depth of T.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
SOD113
2-lead TO-220F
z(2)
0.8
q Tw
2.6 2.55 0.4
ISSUE DATE
02-04-09
07-06-18
Fig 8. Package outline SOD113 (TO-220F)
BYC5DX-500
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 â 6 July 2011
© NXP B.V. 2011. All rights reserved.
7 of 11
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