74F8962 Datasheet, PDF (7/10 Pages) NXP Semiconductors – 9-Bit latched bidirectional Futurebus transceivers open-collector

Philips Semiconductors FAST Products
9-Bit latched bidirectional Futurebus transceivers
(open-collector)
Product specification
74F8962/8963
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
I_OH
High-level output current
B0 – B8
I_OFF
Power-off output current
B0 – B8
V_OH
High-level output voltage
AO0 – AO8⁴
AO0 – AO8⁴
V_OL
Low-level output voltage
B0 – B8
V_IK
I_I
I_IH
I_IL
I_OZH
Input clamp voltage
Input current at
maximum input voltage
High-level input current
Low-level input current
Off state output current,
high-level voltage applied
OEAB, OEBA,
LEAB, LEBA,
AI0 – AI8
B0 – B8
OEAB, OEBA,
LEAB, LEBA,
AI0 – AI8
B0 – B8
OEAB, OEBA,
LEAB, LEBA,
AI0 – AI8
B0 – B8
AO0 – AO8
TEST
CONDITIONS¹
V_CC = MAX, V_IL = MAX, V_IH = MIN, V_OH = 2.1V
V_CC = 0.0V, V_IL = MAX, V_IH = MIN, V_OH = 2.1V
V_CC = MAX, V_IL = MAX, V_IH = MIN, I_OH = –3mA
V_CC = MIN,
I_OL = 24mA
V_IL = MAX
I_OL = 100mA
V_IH = MIN
I_OL = 4mA
V_CC = MIN, I_I = I_IK
LIMITS
MIN TYP² MAX
100
100
2.5
V_CC
0.50
0.75 1.0 1.10
0.40
-1.2
UNIT
µA
µA
V
V
V
V
V
V_CC = MAX, V_I = 7.0V
100 µA
V_CC = MAX, V_I = 5.5V
1
mA
V_CC = MAX, V_I = 2.7V
20 µA
V_CC = MAX, V_I = 2.1V
V_CC = MAX, V_I = 0.5V
100 µA
–100 µA
V_CC = MAX, V_I = 0.3V
V_CC = MAX, V_O = 2.7V
–100 µA
50 ^µA
I_OZL
Off state output current,
low-level voltage applied
V_CC = MAX, V_I = 0.5V
–50 ^µA
I_OS
Short circuit output
current³
AO0 –
AO8
74’FF88996602
V_CC = MAX, Bn = 1.3V, OEBA = 0.8V,
OEAB = 2.7V
only
74F8963
V_CC = MAX, Bn = 1.8V, OEBA = 0.8V,
OEAB = 2.7V
-60
-150 mA
I_CCH
V_CC = MAX
80 110 mA
I_CC
Supply current (total)
I_CCL
V_CC = MAX, V_IL = 0.5V
105 145 mA
I_CCZ
80 110 mA
NOTES TO DC ELECTRICAL CHARACTERISTICS
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V_CC = 5V, T_amb = 25°C.
3. Not more than one output should be shorted at a time. For testing I_OS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I_OS tests should be performed last.
4. Due to test equipment limitations, actual test conditions are for V_IH = 1.8V and V_IL = 1.3V.
March 11, 1993
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