BYC8-600_15 Datasheet, PDF (6/9 Pages) NXP Semiconductors – BYC8-600_15

NXP Semiconductors
10. Package outline
Plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC
BYC8-600
Hyperfast power diode
SOD59
E
P
q
D₁
D
H
A
A₁
Q
b₁
L
1
2
b
c
e
Dimensions
0
5
10 mm
scale
Unit
A A₁ b b₁₍₁₎ c
D D₁ E
e
H
L
P
Q
q
max
mm nom
min
4.7
4.3
1.40 0.95
1.15 0.70
1.7
1.3
0.65 15.8
0.45 15.6
6.8 10.30 _5.08 16.25 15.0 3.80
6.4 9.65 ^(REF) 15.70 12.5 3.65
2.6
2.2
2.9
2.7
Note
1. Protruded dambar are included in the dimension.
Outline
version
References
IEC
JEDEC
JEITA
SOD59
2-lead TO-220AC
Fig. 7. Package outline TO-220AC (SOD59)
BYC8-600
Product data sheet
All information provided in this document is subject to legal disclaimers.
23 May 2013
European
projection
sod059_po
Issue date
09-08-25
12-11-27
© NXP B.V. 2013. All rights reserved
6/9