BTA204-600F Datasheet, PDF (6/13 Pages) NXP Semiconductors – 3Q Hi-Com Triac

NXP Semiconductors
8. Thermal characteristics
Table 5.
Symbol
R_th(j-mb)
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to
mounting base
thermal resistance
from junction to
ambient
Conditions
full cycle; Fig. 6
half cycle; Fig. 6
in free air
10
Z_th(j-mb)
(K/W)
1
BTA204-600F
3Q Hi-Com Triac
Min Typ Max Unit
-
-
3
K/W
-
-
3.7 K/W
-
60
-
K/W
003aag087
(1)
(2)
10^-1
P
10^-2
10^-5
10^-4
10^-3
10^-2
10^-1
t_p
t
1
t_p (s)
10
(1) Unidirectional (half cycle)
(2) Bidirectional (full cycle)
Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse width
BTA204-600F
Product data sheet
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8 August 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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