BLS3135-50 Datasheet, PDF (6/8 Pages) NXP Semiconductors – Microwave power transistor

Philips Semiconductors
Microwave power transistor
PACKAGE OUTLINE
Flanged hermetic ceramic package; 2 mounting holes; 2 leads
Product specification
BLS3135-50
SOT422A
A
L
H U2
AL
D
F
3
D1
U1
B
q
C
c
1
p
E1
E
w1 M _A M _B M
2
b
w2 _{M C M}
Q
0
5
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT A
b
c
D
D1
E
E1
F
H
L
p
Q
q
U1 U2 w1 w2
mm
5.72
4.83
5.21 0.13 9.93 10.29 8.76 10.29 1.58 19.18 4.52
4.95 0.08 9.68 10.03 8.51 10.03 1.47 17.65 3.74
3.43 3.35 _16.51 22.99 9.91
3.18 2.92
22.73 9.65
0.25 0.76
inches ^0.225
0.190
0.205
0.195
0.005 0.391
0.003 0.381
0.405
0.395
0.345
0.335
0.405
0.395
0.062
0.058
0.755
0.695
0.178
0.147
0.135 0.132
0.125 0.115
0.65
0.905 0.390
0.895 0.380
0.01
0.03
OUTLINE
VERSION
IEC
SOT422A
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
99-03-29
1999 Aug 16
6