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74F657 Datasheet, PDF (6/12 Pages) NXP Semiconductors – Octal transceiver with 8-bit parit generator/checker
Philips Semiconductors
Octal transceiver with 8-bit parity generator/checker
Product specification
74F657
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
VOH
High-level output voltage
All outputs
B0 – B7,
PARITY,
ERROR
VCC = MIN,
VIL = MAX,
VIH = MIN
TEST
CONDITIONS1
IOH = –3mA4,5
IOH = –12mA5
IOH = –15mA4
VOL
Low-level output voltage
VIK
Input clamp voltage
Input current at
II
maximum input voltage
IIH
High–level input current
A0 – A7
B0 – B7,
PARITY,
ERROR
OE, T/R,
ODD/EVEN
A0 – A7
B0 – B7
OOD/EVEN
OE, T/R
IOL = 24mA4,5
VCC = MIN,
VIL = MAX,
IOL = 48mA4
VIH = MIN
IOL = 48mA5
IOL = 64mA4
VCC = MIN, II = IIK
VCC = 0.0V, VI = 7.0V
VCC = 5.5V, VI = 5.5V
VCC = MAX, VI = 2.7V
IIL
Low–level input current
OOD/EVEN VCC = MAX, VI = 0.5V
OE, T/R
±10%VCC
±5%VCC
±10%VCC
±5%VCC
±10%VCC
±5%VCC
±10%VCC
±5%VCC
±10%VCC
±5%VCC
±5%VCC
LIMITS
MIN TYP2 MAX
2.4
2.7
2.0
2.0
2.0
2.0
0.35 0.50
0.35 0.50
0.38 0.55
0.42 0.55
0.42 0.55
–0.73 -1.2
100
2
1
204
405
404
805
–20
–40
UNIT
V
V
V
V
V
V
V
V
V
V
V
V
µA
mA
mA
µA
µA
µA
µA
µA
µA
IOZH + IIH
Off–state output current,
high–level voltage applied
A0 – A7,
B0 – B7,
VCC = MAX, VO = 2.7V
70 µA
IOZL + IIL
Off–state output current,
low–level voltage applied
PARITY
VCC = MAX, VO = 0.5V
–70 µA
IOZH
Off–state output current,
High–level voltage applied
ERROR
VCC = MAX, VO = 2.7V
50 µA
IOZL
Off–state output current,
low–level voltage applied
IOS
Short circuit output current3
ICC
Supply current (total)
A0 – A7
B0 – B7
ICCH
VCC = MAX, VO = 0.5V
VCC = MAX
ICCL
VCC = MAX
–50 µA
-60
-150 mA
-100
-225 mA
90 1254 mA
90 1355 mA
106 1504 mA
106 1605 mA
ICCZ
98 145 mA
Notes to DC electrical characteristics
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.
4. For commercial range.
5. For industrial range.
90 July 30
6