TDA8552T Datasheet, PDF (5/28 Pages) NXP Semiconductors – 2 x 1.4 W BTL audio amplifiers with digital volume control and headphone sensing

Philips Semiconductors
2 × 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing
Preliminary specification
TDA8552T; TDA8552TS
PINNING
SYMBOL
GND1
OUT2+
V_DD1
HPS
MODE
UP/DOWN1
UP/DOWN2
V_DD2
OUT2−
GND2
GND3
OUT1+
V_DD3
GAINSEL
IN2
SVR
IN1
V_DD4
OUT1−
GND4
PIN⁽¹⁾
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
DESCRIPTION
ground 1, substrate/leadframe
positive loudspeaker terminal
output channel 2
supply voltage 1
digital input for headphone
sensing
digital trinary input for mode
selection (standby, mute and
operating)
digital trinary input for volume
control channel 1
digital trinary input for volume
control channel 2
supply voltage 2
negative loudspeaker terminal
output channel 2
ground 2, substrate/leadframe
ground 3, substrate/leadframe
positive loudspeaker terminal
output channel 1
supply voltage 3
digital input for gain selection
audio input channel 2
half supply voltage, decoupling
ripple rejection
audio input channel 1
supply voltage 4
negative loudspeaker terminal
output channel 1
ground 4, substrate/leadframe
Note
1. For the SO20 (SOT163-1) package only: the ground
pins 1, 10, 11 and 20 are mechanically connected to
the leadframe and electrically to the substrate of the
die. On the PCB the ground pins can be connected to
a copper area to decrease the thermal resistance.
handbook, halfpage
GND1 1
20 GND4
OUT2+ 2
19 OUT1−
VDD1 3
HPS 4
18 VDD4
17 IN1
MODE 5
16 SVR
TDA8552T
UP/DOWN1 6
15 IN2
UP/DOWN2 7
14 GAINSEL
VDD2 8
OUT2− 9
13 VDD3
12 OUT1+
GND2 10
11 GND3
MGM610
Fig.2 Pin configuration.
1998 Jun 02
5