SA2421 Datasheet, PDF (5/12 Pages) NXP Semiconductors – 2.45 GHz low voltage RF transceiver

Philips Semiconductors
2.45 GHz low voltage RF transceiver
Product specification
SA2421
AC ELECTRICAL CHARACTERISTICS (continued)
SYMBOL
PARAMETER
LIMITS
TEST CONDITIONS
UNITS
MIN
–3σ
TYP
+3σ MAX
Tx Mixer (Tx OUT = Pin 17, IF = Pins 7 and 8, LO = Pin 10 or 12, P_LO = –10 dBm)
PG_C
Power conversion gain: R_L = 50 Ω
R_S = 50 Ω
f_S = 2.45 GHz,
f_LO = 2.1 GHz,
f_IF = 350 MHz
S_11–RF Output match at RF (2.45 GHz)¹
NF_M
SSB noise figure (2.45 GHz) (50 Ω)
P_-1dB Output 1dB gain compression
IP3
Output third order intercept
f₁ – f₂ = 1 MHz
Tx Mixer Spurious Components (P_OUT = P_–1dB)
P_IF-RF IF feedthrough to RF⁴
P_LO-RF LO feedthrough to RF⁵
P_IMAGE-RF Image feedthrough to RF⁶
LO Buffer
22.5
23
23.5
–10
10.9
11.2
11.5
4.2
10.1 12.2 14.3
–50
–22
–20
dB
dB
dB
dBm
dBm
dBc
dBc
dBc
P_{LO IN} LO drive level
S_11-LO Mixer input match (LO = 2.1 GHz)
f_LOG
LOG frequency range³
Switching²
–15
–10
–5
dBm
–10
dB
1.9
2.1
2.3
GHz
t_Rx-Tx Receive-to-transmit switching time
1
µs
t_Tx-Rx Transmit-to-Receive switching time
1
µs
t_{POWER UP} Chip enable time
1
µs
t_{PWR DWN} Chip disable time
1
µs
NOTES:
1. With simple external matching
2. With 50 pF coupling capacitors on all RF and IF parts
3. This part has been optimized for the stated frequency range. Operation outside this frequency range may yield performance other than
specified in this datasheet.
4. Measured 5dB lower than 1dB compression point, with typical output matching network.
5. Measured at 1dB compression point.
6. With typical output matching network (no image reject mixer is used).
2000 Mar 13
5