HT1DC20S30 Datasheet, PDF (5/8 Pages) NXP Semiconductors – HITAG 1 stick transponder

Philips Semiconductors
HITAG 1 stick transponder
Product specification
HT1DC20S30
idth
Bmax Bmin
Definitions:
m = _{B-B----mm-----aa---xx-----+–}----BB----m-m----i-i-nn--
mread = Bmax – Bmin
MGW174
Fig.2 Definition of modulation index.
MECHANICAL CHARACTERISTICS
The transponder is sealed in epoxy resin moulding compound. The designation of the package is SOT385-1
(see Chapter “Package outline”).
PARAMETER
Mechanical dimensions
Protection class
Casting material
Transponder IC type
12 × 6 × 3 mm
IP67
epoxy resin
HT1ICS30
VALUE
2001 Sep 24
5