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BUK7277-55A Datasheet, PDF (5/13 Pages) NXP Semiconductors – TrenchMOS standard level FET | |||
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Philips Semiconductors
BUK7277-55A
TrenchMOS⢠standard level FET
8. Characteristics
Table 5: Characteristics
Tj = 25 °C unless otherwise speciï¬ed
Symbol Parameter
Static characteristics
V(BR)DSS drain-source breakdown voltage
VGS(th) gate-source threshold voltage
IDSS
drain-source leakage current
IGSS
RDSon
gate-source leakage current
drain-source on-state resistance
Dynamic characteristics
Ciss
input capacitance
Coss
output capacitance
Crss
reverse transfer capacitance
td(on)
turn-on delay time
tr
td(off)
rise time
turn-off delay time
tf
fall time
Ld
internal drain inductance
Ls
internal source inductance
Conditions
ID = 0.25 mA; VGS = 0 V
Tj = 25 °C
Tj = â55 °C
ID = 1 mA; VDS = VGS; Figure 9
Tj = 25 °C
Tj = 175 °C
Tj = â55 °C
VDS = 55 V; VGS = 0 V
Tj = 25 °C
Tj = 175 °C
VGS = ±20 V; VDS = 0 V
VGS = 10 V; ID = 10 A; Figure 7 and 8
Tj = 25 °C
Tj = 175 °C
VGS = 0 V; VDS = 25 V; f = 1 MHz; Figure 12
VDD = 30 V; RL = 1.2 â¦; VGS = 10 V; RG = 10 â¦
measured from drain lead from package to
centre of die
measured from source lead from package to
source bond pad
Min Typ Max Unit
55 â â V
50 â â V
234V
1ââV
â â 4.4 V
â 0.05 10 µA
â â 500 µA
â 2 100 nA
â 65 77 mâ¦
â â 154 mâ¦
â 316 422 pF
â 92 110 pF
â 64 87 pF
â 10 â ns
â 50 â ns
â 70 â ns
â 40 â ns
â 2.5 â nH
â 7.5 â nH
9397 750 07698
Product speciï¬cation
Rev. 01 â 1 February 2001
© Philips Electronics N.V. 2001. All rights reserved.
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