BAT254 Datasheet, PDF (5/8 Pages) NXP Semiconductors – Schottky barrier diode

Philips Semiconductors
Schottky barrier diode
Product specification
BAT254
MOUNTING
Reflow soldering
Follow standard reflow soldering techniques to ensure
correct application of solder paste and placement of the
SOD110 package (see Fig.6).
Wave soldering
Before wave soldering, attach SOD110 packages to the
printed-circuit boards using a small dot of thermo-setting
epoxy or UV-curing adhesive centred between the
soldering lands (see Fig.7).
3.00
,,,,,,,,,, ^{handbook, halfpage}
1.25
1.00
1.00
MGC119
Dimensions in mm.
Fig.6 SOD110 reflow soldering pattern.
,,,, ,,,,,, ^{handbook,halfpage}
3.40
1.25
1.10
1.10 ^MGC126
Dimensions in mm.
Fig.7 SOD110 wave soldering pattern.
1999 Apr 22
5