SC68C752B Datasheet, PDF (46/49 Pages) NXP Semiconductors – 5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs and Motorola uP interface

Philips Semiconductors
SC68C752B
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Abbreviations
Table 29: Abbreviations
Acronym
Description
CPU
Central Processing Unit
DMA
Direct Memory Access
FIFO
First In/First Out
LSB
Least Significant Bit
MSB
Most Significant Bit
UART
Universal Asynchronous Receiver and Transmitter
SC68C752B_3
Product data sheet
Rev. 03 — 29 November 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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