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LPC2220 Datasheet, PDF (45/49 Pages) NXP Semiconductors – 16/32-bit ARM microcontrollers; flashless with 64 kB, with 10-bit ADC and external memory interface
Philips Semiconductors
LPC2210/2220
16/32-bit ARM microcontrollers with external memory interface
TFBGA144: plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm
D
B
D1
A
ball A1
index area
E1 E
A A2
A1
detail X
SOT569-1
e1
e
b
C
∅v M C A B
y1 C
y
∅w M C
P
N
M
L
K
J
H
G
F
E
D
C
B
ball A1
A
index area
shape
1 2 3 4 5 6 7 8 9 10 11 12 13
optional (4×)
e
e2
0
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
b
D
D1 E
E1
mm 1.2 0.36 0.84 0.53 12.2 11.9 12.2 11.9
0.24 0.74 0.43 11.8 11.7 11.8 11.7
5
scale
e
e1
0.8 9.6
X
10 mm
e2
v
w
y
y1
9.6 0.15 0.08 0.1 0.1
OUTLINE
VERSION
IEC
SOT569-1
REFERENCES
JEDEC
JEITA
MO-216
Fig 16. Package outline SOT569-1 (TFBGA144)
9397 750 14061
Product data sheet
Rev. 02— 30 May 2005
EUROPEAN
PROJECTION
ISSUE DATE
03-03-03
03-07-09
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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