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NE57810 Datasheet, PDF (4/16 Pages) NXP Semiconductors – Advanced DDR memory termination power with external reference in
Philips Semiconductors
Advanced DDR memory termination power
with external reference in
Product data
NE57810
ELECTRICAL CHARACTERISTICS
Tamb = 0 °C to +75 °C, VDD = 2.5 V; ITT = –3.5 A to +3.5 A, unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VTT
Output voltage
ExtRefIn not connected
–
VDD/2
–
V
VACC
Output voltage accuracy (Note 5)
ITT = 0 A, ExtRefIn not connected
–15
–
+15
mV
VDD
Supply voltage
1.6
–
3.6
V
IQ
Supply current
ITT = 0 A
–
14
30
mA
ITT
Output current
2.5 V ≤ VDD ≤ 3.6 V
–3.5
–
+3.5
A
VDD = 1.6 V
–2.5
–
+2.5
A
∆VTT
Load regulation
ITT = ±1.0 A
–
±6
–
mV
ITT = ±3.5 A
–18
–
+18
mV
CLOAD
Load capacitance (Note 2)
Stable operation
–
100
–
µF
External Reference In
VTT
Rin(ExtRefIn)
Output voltage swing
Input impedance
Output voltage accuracy (Note 3)
Line regulation
Reference Out
ITT = 0 A
ExtRefIn = 1.25 V;
VDD = 2.25 – 3.6 V
0.8
–
VDD – 0.8
V
35
50
–
kΩ
–15
–
+15
mV
–6
–
+6
mV
RefOut
Voltage reference out (Note 4)
IrefOut = 0 A; source or sink
–15
ExtRefIn
+15
mV
IrefOut
Reference Out current max
2.2
3
–
mA
CLOAD
Load capacitance
Power Stage
Stable operation
0.1
–
–
µF
Ilim
Current limit
3.6
4.5
6.5
A
Tlim
Temperature shutdown
–
+150
–
°C
Temperature shutdown hysteresis
–
20
–
°C
NOTE:
1. Limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlation using Statistical
Quality Control (SQC) methods.
2. Ceramic capacitors only. Low ESR electrolytic capacitors are not necessary.
3. Voltage Accuracy referred to voltage at ExtRefIn pin.
4. RefOut voltage referenced to 1/2 VDD if ExtRefIn not connected.
5. VACC = VTT – VDD/2.
2003 Sep 12
4