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BYC58X-600_15 Datasheet, PDF (4/11 Pages) NXP Semiconductors – 8 A hyperfast rectifier diode
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NXP Semiconductors
5. Thermal characteristics
Table 5.
Symbol
Rth(j-h)
Rth(j-a)
Thermal characteristics
Parameter
Conditions
thermal resistance from
junction to heatsink
with heatsink compound; see Figure 3
thermal resistance from in free air
junction to ambient free air
10
Zth(j-h)
(K/W)
1
BYC58X-600
8 A hyperfast rectifier diode
Min Typ Max Unit
-
2.5 3
K/W
-
55
-
K/W
003aac889
10−1
P
10−2
10−3
10−5
10−4
10−3
10−2
10−1
tp
t
1
10
tp (s)
Fig 3. Transient thermal impedance from junction to heatsink as a function of pulse width
6. Isolation characteristics
Table 6.
Symbol
Visol(RMS)
Cisol
Isolation characteristics
Parameter
Conditions
RMS isolation voltage
50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; from all pins to
external heatsink; sinusoidal waveform; clean
and dust free
isolation capacitance f = 1 MHz; from cathode to external heatsink
Min Typ Max Unit
-
-
2500 V
-
10
-
pF
BYC58X-600_1
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 23 February 2010
© NXP B.V. 2010. All rights reserved.
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