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| BYC20X-600P_15 Datasheet, PDF (4/9 Pages) NXP Semiconductors – Hyperfast power diode | |||
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NXP Semiconductors
BYC20X-600P
Hyperfast power diode
9. Thermal characteristics
Table 6.
Symbol
Rth(j-h)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to
heatsink
thermal resistance
from junction to
ambient free air
Conditions
with heatsink compound ; Fig. 5
10
Zth(j-h)
(K/W)
1
Min Typ Max Unit
-
-
3.5 K/W
-
55
-
K/W
003aak764
10-1
δ = 0.5
δ = 0.3
10-2
δ = 0.1
δ = 0.05
δ = 0.02
10-3
δ = 0.01
P
tp
δ= T
single pulse
10-4
10-6
10-5
10-4
10-3
10-2
10-1
tp
T
1
tp (s)
t
10
Fig. 5. Transient thermal impedance from junction to heatsink as a function of pulse duration
10. Isolation characteristics
Table 7. Isolation characteristics
Symbol
Parameter
Conditions
Visol(RMS)
RMS isolation voltage
50 Hz ⤠f ⤠60 Hz; RH ⤠65 %; from all
pins to external heatsink; sinusoidal
waveform; clean and dust free
Cisol
isolation capacitance f = 1 MHz ; from cathode to external
heatsink
Min Typ Max Unit
-
-
2500 V
-
10
-
pF
11. Characteristics
Table 8. Characteristics
Symbol
Parameter
Static characteristics
VF
forward voltage
BYC20X-600P
Product data sheet
Conditions
IF = 20 A; Tj = 25 °C; Fig. 6
All information provided in this document is subject to legal disclaimers.
4 February 2013
Min Typ Max Unit
-
1.8 2.5 V
© NXP B.V. 2013. All rights reserved
4/9
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