BUK9226-75A Datasheet, PDF (4/13 Pages) NXP Semiconductors – TrenchMOS logic level FET

Philips Semiconductors
BUK9226-75A
TrenchMOS™ logic level FET
7. Thermal characteristics
Table 4: Thermal characteristics
Symbol Parameter
R_th(j-a)
R_th(j-mb)
thermal resistance from junction to ambient
thermal resistance from junction to mounting
base
Conditions
minimum footprint; FR4 board
Figure 4
7.1 Transient thermal impedance
Value Unit
71.4 K/W
1.3 K/W
10
Zth(j-mb)
(K/W)
1
0.5
0.1
0.2
0.1
0.05
0.02
0.01
Single Shot
0.001
10-6
10-5
10-4
10-3
03nb20
P
δ
=
tp
T
10-2
tp
t
T
10-1
1
tp (s)
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration.
9397 750 07585
Product specification
Rev. 01 — 10 October 2000
© Philips Electronics N.V. 2000. All rights reserved.
4 of 13