BGY2016 Datasheet, PDF (4/12 Pages) NXP Semiconductors – UHF amplifier module

Philips Semiconductors
UHF amplifier module
APPLICATION INFORMATION
handbook, full pagewidth
Product specification
BGY2016
C7
C8
C5
C6
Z1
50 Ω
input
R1
L1
R2
L2
Z2
C3
C4
C1
C2
VS1
VS2
50 Ω
output
MGM861
Fig.2 Test circuit.
List of components (See Figs 2 and 3)
COMPONENT
DESCRIPTION
VALUE
CATALOGUE NO.
C1, C2
C3, C4
C5, C6
C7, C8
L1, L2
R1, R2
Z₁, Z₂
electrolytic capacitor
multilayer ceramic chip capacitor
multilayer ceramic chip capacitor
multilayer ceramic chip capacitor
Grade 4S2 Ferroxcube bead
metal film resistor
stripline; note 1
10 µF; 35 V
10 nF; 50 V
100 pF; 50 V
10 pF; 50 V
−
10 Ω; 0.4 W
50 Ω
−
−
−
−
4330 030 36300
2322 195 13109
−
Note
1. The striplines are on a double copper-clad printed-circuit board with epoxy dielectric (ε_r = 4.5); thickness = 1 mm.
2000 Jan 04
4