BAP70-04W_15 Datasheet, PDF (4/8 Pages) NXP Semiconductors – Silicon PIN diode

NXP Semiconductors
8. Package outline
Plastic surface-mounted package; 3 leads
D
B
BAP70-04W
Silicon PIN diode
SOT323
E
A
X
y
3
1
e1
bp
e
2
wM B
HE
vM A
A
A1
Q
c
Lp
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
max
bp
c
D
E
e
e1 HE Lp
Q
v
w
mm
1.1
0.8
0.1
0.4
0.3
0.25 2.2
0.10 1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45 0.23
0.15 0.13
0.2
0.2
OUTLINE
VERSION
IEC
SOT323
Fig 3. Package outline SOT323
BAP70-04W
Product data sheet
REFERENCES
JEDEC
JEITA
SC-70
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 16 April 2014
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
© NXP Semiconductors N.V. 2014. All rights reserved.
4 of 8