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74F64 Datasheet, PDF (4/8 Pages) NXP Semiconductors – 4-2-3-2-input AND-OR-invert gate
Philips Semiconductors
4-2-3-2-input AND-OR-invert gate
Product specification
74F64
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
VCC
VIH
VIL
IIK
IOH
IOL
Tamb
Supply voltage
High-level input voltage
Low-level input voltage
Input clamp current
High-level output current
Low-level output current
Operating free-air temperature range
LIMITS
MIN
NOM
MAX
4.5
5.0
5.5
2.0
0.8
–18
–1
20
0
+70
UNIT
V
V
V
mA
mA
mA
°C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST CONDITIONS1
LIMITS
MIN
TYP2
MAX
UNIT
VOH
High-level output voltage
VCC = MIN, VIL = MAX ±10%VCC
2.5
V
VIH = MIN, IOH = MAX
±5%VCC
2.7
3.4
V
VOL
Low-level output voltage
VCC = MIN, VIL = MAX
VIH = MIN, IOL = MAX
±10%VCC
±5%VCC
0.30
0.50
V
0.30
0.50
V
VIK
Input clamp voltage
VCC = MIN, II = IIK
–0.73
–1.2
V
II
Input current at maximum input
voltage
VCC = MAX, VI = 7.0V
100
µA
IIH
High-level input current
VCC = MAX, VI = 2.7V
20
µA
IIL
Low-level input current
VCC = MAX, VI = 0.5V
–0.6
mA
IOS
Short-circuit output current3
VCC = MAX
–60
–150
mA
ICC
Supply current (total)
ICCH
ICCL
VCC = MAX
VIN = GND
VIN = 4.5V
1.9
2.8
mA
3.1
4.7
mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at VCC = 5V, Tamb = 25°C.
3. Not more than one output should be shorted at a time. For testing IOS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, IOS tests should be performed last.
1996 Mar 14
4