TDA4661 Datasheet, PDF (3/6 Pages) NXP Semiconductors – Baseband delay line

Philips Semiconductors
Baseband delay line
Product specification
TDA4661
PINNING
SYMBOL
V_P2
n.c.
GND2
i.c.
SAND
n.c.
i.c.
i.c.
V_P1
GND1
V_O(R−Y)
V_O(B−Y)
n.c.
V_I(B−Y)
n.c.
V_I(R−Y)
PIN
DESCRIPTION
1 +5 V supply voltage for digital part
2 not connected
3 ground for digital part (0 V)
4 internally connected
5 sandcastle pulse input
6 not connected
7 internally connected
8 internally connected
9 +5 V supply voltage for analog part
10 ground for analog part (0 V)
11 ±(R−Y) output signal
12 ±(B−Y) output signal
13 not connected
14 ±(B−Y) input signal
15 not connected
16 ±(R−Y) input signal
MEH183
V _P2 1
n.c. ²
GND2 3
i.c. 4
SAND 5
TDA4661
n.c. 6
i.c. 7
i.c. 8
16 VI(R_−Y)
15 n.c.
14 VI(B_−Y)
13 n.c.
12 VO(B_−Y)
11 VO(R_−Y)
10 GND1
9 VP1
Fig.2 Pin configuration.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134). Ground pins 3 and 10 connected together.
SYMBOL
V_P1
V_P2
V₅
V_n
T_stg
T_amb
V_ESD
PARAMETER
supply voltage (pin 9)
supply voltage (pin 1)
voltage on pin 5
voltage on pins 11, 12, 14 and 16
storage temperature
operating ambient temperature
electrostatic handling for all pins (note 1)
MIN.
−0.5
−0.5
−0.5
−0.5
−25
0
−
MAX.
+7
+7
V_P + 1.0
V_P
+150
70
±500
UNIT
V
V
V
V
°C
°C
V
Note
1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.
THERMAL CHARACTERISTICS
SYMBOL
R_thj-a
PARAMETER
thermal resistance from junction to ambient in free air
SOT38-4
SOT109-1
VALUE
75
220
UNIT
K/W
K/W
December 1994
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