PMEG2010EPK_15 Datasheet, PDF (3/14 Pages) NXP Semiconductors – 20 V, 1 A low VF MEGA Schottky barrier rectifier

NXP Semiconductors
PMEG2010EPK
20 V, 1 A low VF MEGA Schottky barrier rectifier
5. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
V_R
I_F
I_F(AV)
I_FRM
I_FSM
P_tot
reverse voltage
T_j = 25 °C
forward current
T_sp ≤ 130 °C
average forward current
square wave; δ = 0.5; f = 20 kHz;
[1]
T_amb ≤ 110 °C
square wave; δ = 0.5; f = 20 kHz;
T_sp ≤ 135 °C
repetitive peak forward current t_p ≤ 1 ms; δ ≤ 0.25
non-repetitive peak forward
current
square wave; t_p = 8 ms; T_j(init) = 25 °C
total power dissipation
T_amb ≤ 25 °C
[2]
[3]
[1]
T_j
T_amb
T_stg
junction temperature
ambient temperature
storage temperature
[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al₂O₃, standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm².
6. Thermal characteristics
Min Max Unit
-
20 V
-
1.4 A
-
1
A
-
1
A
-
3
A
-
5
A
-
410 mW
-
860 mW
-
1565 mW
-
150 °C
-55 150 °C
-65 150 °C
Table 6.
Symbol
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance
from junction to
ambient
Conditions
in free air
R_th(j-sp)
thermal resistance
from junction to solder
point
Min Typ Max Unit
[1][2]
-
-
305 K/W
[1][3]
-
-
145 K/W
[1][4]
-
-
80 K/W
[5]
-
-
20 K/W
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses P_R are a
significant part of the total power losses.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm².
[4] Device mounted on a ceramic PCB, Al₂O₃, standard footprint.
[5] Soldering point of cathode tab.
PMEG2010EPK
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 March 2012
© NXP B.V. 2012. All rights reserved.
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