NX3P1108_15 Datasheet, PDF (3/16 Pages) NXP Semiconductors – NX3P1108_15

NXP Semiconductors
NX3P1108
Logic controlled high-side power switch
7.2 Pin description
Table 3. Pin description
Symbol
Pin
VOUT
A1
GND
B1
VIN
A2
EN
B2
8. Functional description
Description
output voltage
ground (0 V)
input voltage
enable input (active HIGH)
Table 4. Function table^[1]
Input EN
L
H
[1] H = HIGH voltage level; L = LOW voltage level.
9. Limiting values
Switch
switch OFF
switch ON
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Min
Max
Unit
V_I
input voltage
input EN
input VIN
[1] _0.5
+4.0
V
[2] _0.5
+4.0
V
V_SW
I_IK
I_SK
I_SW
T_j(max)
switch voltage
input clamping current
switch clamping current
switch current
maximum junction
temperature
output VOUT
input EN: V_I(EN) < 0.5 V
input VIN: V_I(VIN) < 0.5 V
output VOUT: V_O(VOUT) < 0.5 V
output VOUT: V_O(VOUT) > V_I(VIN) + 0.5 V
V_SW > 0.5 V
[2] _0.5
50
50
50
-
-
40
V_I(VIN)
V
-
mA
-
mA
-
mA
50
mA
1500 mA
+125
C
T_stg
storage temperature
P_tot
total power dissipation
65
[3] _-
+150
C
300
mW
[1] The minimum input voltage rating may be exceeded if the input current rating is observed.
[2] The minimum and maximum switch voltage ratings may be exceeded if the switch clamping current rating is observed.
[3] The (absolute) maximum power dissipation depends on the junction temperature Tj. Higher power dissipation is allowed in conjunction
with lower ambient temperatures. The conditions to determine the specified values are T_amb = 85 C and the use of a two layer PCB.
NX3P1108
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 9 January 2013
© NXP B.V. 2013. All rights reserved.
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